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product structure: semiconductor ic this product is not designed for protection against radioactive rays . 1/ 20 tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 tsz22111 ? 14 ? 001 www.rohm.com inverter for motor control 600v igbt intelligent power module (ipm) for high speed switching drive bm63 7 63 s- va bm63763s- vc general description bm637 63 s-va /- vc is an intelligent power module composed of gate drivers , bootstrap diodes, igbts, fly wheel diodes . small switching loss igbts optimized for high speed switching drive such as a washing machine or a fan motor is adopted. features ? 3phase dc/ac inverter ? 600v/10a ? low side igbt open emitter ? built -in bootstrap diode ? high side igbt gate driver(hvic): soi (silicon on insulator) process, drive circuit, high voltage level shifting, current limit for bootstrap diode, control supply u nder -voltage locked out (uvlo) ? low side igbt gate driver(lvic): drive circuit, short circuit current protection (scp), control supply under voltage locked out (uvlo), thermal shutdown (tsd) ? fault signal(lvic) corresponding to scp (low side igbt), tsd, uvlo f ault ? input interface 3.3v, 5v line application ? high speed switching drive of ac100 to 240vrms(dc voltage: less than 400v) class motor ? high speed switching drive of motor for washing machine, fan key specifications ? igbt collector-emitter voltage v ce sat : 1. 7v(typ) ? fwd forward voltage v f : 1.5v(typ) ? fwd reverse recovery time t rr : 100ns(typ) ? module case temperature t c : - 25 to +100 c ? junction temperature t jmax : 150 c package w(typ) x d(typ) x h(typ) hsdip 25 38.0mm x 24.0mm x 3.5 mm hsdip25 vc 38.0mm x 24.0mm x 3.5mm typical application circ uit figure 1. example of application circuit hinu hinv hinw hvcc gnd linu linv linw lvcc fo cin gnd p u v w nu nv nw m 24 23 22 21 20 19 18 mcu + 8 9 15 16 15v 14 10 11 12 13 5 6 7 5v + 2 3 4 + vbw vbv vbu + + hsdip25 datashee t
2 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 pin configuration pin descriptio n pin no. pin name function pin no. pin name function 1 nc no connection(gnd potential) 14 fo alarm output 2 vbu u phase floating control supply 15 cin d etecting of short circuit current trip voltage 3 vbv v phase floating control s upply 16 gnd ground (note 1) 4 vbw w phase floating control supply 17 nc no connection (note 2) 5 hinu u phase high side igbt control 18 nw w phase low side igbt emitter 6 hinv v phase high side igbt control 19 nv v phase low side igbt emitter 7 hinw w phase high side igbt control 20 nu u phase low side igbt emitter 8 hvcc control supply for hvic 21 w w phase output 9 gnd ground (note 1) 22 v v phase output 10 linu u phase low side igbt control 23 u u phase output 11 linv v phase low side igbt contr ol 24 p inverter supply 12 linw w phase low side igbt control 25 nc no connection (note 2) 13 lvcc control supply for lvic (note 1) two gnd pins ( 9 & 16pin) are connected inside ipm, please connect one pin ( 16pin is recommended) to the 15v power supply gnd outside and leave the other open. (note 2) nc pins (17 & 25pin) are not electrically connected to any other potential inside. fig ure 2 . pin configuration and tc detecting point 18 25 19 20 21 22 23 24 nw nv nu w v u p nc nc vbu vbv vbw hinu hinv hinw hvcc gnd linu linv linw lvcc fo cin gnd nc top view tc detecting point 17 25 18 1 12.6mm 9.2mm
3 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 block diagra m description of block 1) high side igbt drive (hvic, bootstr ap d iode) high voltage level shifting circuit drives high side igbt. built - in bootstrap diode and current limit function for bootstrap diode enable hvic to drive high side igbt without external component (bootstrap diode, resistor). there is under - voltage - locked - out (uvlo) function for floating control power supply. 2 ) low side igbt d rive (lvic) there is short circuit current protection (scp), under - voltage locked out (uvlo) for control power supply lvcc, t hermal shutdown (tsd) function. alarm signal (fo) will output when t hese protection circuits work . vbu vbv vbw hinu hinv hinw hvcc gnd linu linv linw lvcc fo cin gnd p u v w nu nv nw low side gate driver (lvic) high side gate driver (hvic) 24 23 22 21 20 19 18 2 3 4 8 9 15 16 14 10 11 12 13 5 6 7 fig ure 3. block diagram
4 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 absolute maximum ratings (unless otherwise specified, tj=25 c) inverter p art item symbol ratings unit conditions supply v oltage v p 450 v applied b etween p - nu,nv,nw supply v oltage ( s urge ) v p(surge) 500 v a pplied between p - nu,nv,nw collector - emitter v oltage v ces 600 v collector c urrent dc i c 1 0 (note 1) a t c =25 c peak i cp 20 (note 1) a t c =25 c , less than 1ms collector p ower d issipation p c 33 w t c =25 c , per 1 chip junction t emperature t jmax 150 c (note 1) do not, however exceed p c , as o. control part item symbol ratings unit conditions control power s upply v cc 20 v applied between hvcc - gnd, lvcc - gnd floating control power s upply v bs 20 v applied between vbu - u, vbv - v, vbw - w control input v oltage v in - 0.5 to v cc + 0.5 v applied between hinx, linx - gnd (x=u,v, w) fault output supply v oltage v fo - 0.5 to v cc + 0.5 v applied between fo - gnd fault output c urrent i fo 1 ma sink current at f o pin current sensing i n put v oltage v cin - 0.5 to +7.0 v applied betw een cin - gn d bootstrap diode p art item symbol ratings unit conditions reverse v oltage v rb 600 v junction t emperature t jmaxd 150 c total system item symbol ratings unit conditions self protection supply v oltage (scp c apability) v p(prot) 400 v v cc =1 3.5 to 16.5v, inverter part t j =125 c , non - repetitive, less than 2 s module case t emperature t c - 25 to +100 c measurement point of t c is provided in figure 2 storage t emperature t stg - 40 to +125 c isolation v oltage v iso 1500 v rms sinusoidal , 60hz, ac 1minute, between connected all pins and hea t sink plate thermal resistance item symbol limit unit conditions min typ max junction to case thermal r esistance (note 2 ) r th(j - c)_igbt - - 3. 7 c /w inverter igbt(1/6 module ) r th(j - c)_fwd - - 4.5 c /w inverter fwd(1/6 module ) (note 2) grease with good conductivity and high reliability should be applied evenly with +100 to +200 m on the contacting surface of ipm and heat sink. use a torque wrench to fasten up to the specified torque rating. the contact ing thermal resistance between ipm case and heat sink is determined by the thickness and the thermal conductivity of the applied grease. caution: operating the i pm over the absolute maximum ratings may damage the i pm . the damage can either be a short circu it between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the i pm is operated over the absolute maximum ratings.
5 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 recommended op erating conditions item symbol limit unit conditions min typ max supply v oltage v p 0 300 400 v applied between p - nu,nv,nw control power s upply v cc 13.5 15.0 16.5 v applied between hvcc - gnd, lvcc - gnd floating control power s upply v bs 13.0 15.0 18.5 v applied between vbu - u, vbv - v, vbw - w control power supply v ariation % v cc % v bs - 1 - + 1 v/ s control input v oltage v in 0 - 5.5 v current sensing input v oltage v cin 0 - 5.5 v blanking time for p reventing arm - short t dead 1.5 - - s for each input signa l pwm input f requency f pwm - - 2 0 khz t c 50% 50% hinx linx v ce 10% 90% 10% i c t off t doff t c(off) t f 10% 10% 90% t on t don t rr t c(on) fig ure 4. switching time d efinition
6 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 c o ntrol part item symbol limit unit conditions min typ max whole vcc circuit c urrent 1 i cc1 - 0.70 1.6 0 ma vin=0v vcc circuit c urrent 2 i cc2 - 0.90 2.0 0 ma vin=5v vbs circuit c urrent 1 i bs1 - 0.15 0.35 ma vin=0v vbs circuit c ur rent 2 i bs2 - 0.15 0.35 ma vin=5v control i nput(hinu,hinv,hinw,linu,linv,linw) h level input c urrent i inh 0.7 1.0 1.5 ma v in =5v l level input c urrent i inl - 10 - - a v in =0v h level input threshold v oltage v inh - - 2.6 v l level input threshold v oltag e v inl 0.8 - - v input hysteresis v oltage v hys - 0.25 - v short circuit current p rotection ci n i nput bias c urrent i cin - 2 - - a cin=0v trip v oltage v sc 0.43 0.48 0.53 v under voltage locked o ut vc c trip v oltage v ccuvt 10.5 11.5 12.5 v vcc relea se v oltage v ccuvr 11 12 13 v vb s trip v oltage v bsuvt 10 11 12 v vb s release v oltage v bsuvr 10.5 11.5 12.5 v thermal s hutdown trip t emperature t sdt 100 130 - c monitor lvic t emperature hysteresis t emperature t sd hys - 20 - c monitor lvic t emperatur e fault o utput(fo) output low v oltage v fo - - 0.95 v i fo =1ma leak c urrent i foleak - - 10 a v fo =5v outpu t pulse w idth t fo 20 - - s bootstrap diode p art item symbol limit unit conditions min typ max forward v oltage v fb 1 0.3 0.6 0.9 v i fb =1m a v oltage drop between hvcc - vbx (x=u,v,w) v fb 2 1.1 2.0 2.9 v i fb =100m a voltage drop between hvcc - vbx (x=u,v,w) reverse c urrent i rb - - 10 a v rb =600v reverse recovery t ime t rrb - 80 - ns i fb =0.1a
7 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 mechanical characteristics and ratings item limit unit following s tandard conditions min typ max mounting t orque 0.59 0.69 0.78 n >? m - mounting s crew m3 (note 1) recommended 0.69n >? m (note 2) pin pulling s trength 10 - - s eiaj - ed - 4701/400 load control pin : 4.9n power pin : 9.8n pin bending s trength 2 - - times eiaj - ed - 4701/400 load control pin : 2.45n power pin : 4.9n 90deg. b end weight - 10 - g - heat sink f latness 0 - +200 m - measurement p oint is provided in figure 6 . (note 1) plain washers ( iso 7089 to 7094) are recommended. (note 2) when installing a module to a heat sink, excessive uneven fastening force might apply stress to in side chips or ceramic of heat sink plate, which will lead to a broken or cracked or degraded device. an example of recommended fastening sequence is shown in figure 5. the tempor ary fastening torque is set to 20 to 30% of the maximum torque rating. evenly apply thermally - conductive grease with 100 m to 200 m thickness over the contact surface between the module and the heat sink. also, pay attention not to have any dirt left on the contact surface between th e module and the heat sink . fig ure 6 . measurement point of heat sink flatness fig ure 5 . example of recommended fast ening sequence (+) (+) top view 2 1 temporary fastening >8 1 2 permanent fastening >8 1 2
8 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 t ypical performance curve fig ure 7 . i f vs v f characteristic of bootstrap diode i f - v f c urve between hvcc - vbx pin (x=u,v,w) fig ure 8 . magnification of figure 7 fig ure 9 . v fo vs i fo ( characteristic of fo pin v fo - i fo c urve ) 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 1.0 i fo [ma] v fo [v] t j=25 v cc =15v 0 100 200 300 400 500 0 3 6 9 12 15 v f [v] i f [ma] tj=25 v cc =15v 0 25 50 75 100 125 150 175 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 v f [v] i f [ma] t j=25 v cc =15v
9 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 timing chart 1) short circuit current protection (p rotection with the external shunt resistor and rc filter) a1. normal operat ion: igbt on and outputs current i c . a2. short circuit current detection (scp trigger) it is recommended to set rc time constant of 1.0 to 2.0 s so that igbt shuts down within 2.0 s when scp is triggered. a3. all low side igbt s don
10 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 2) control supply (lvcc) under voltage l ocked o ut ( uvlo) b 1 control supply(lvcc) voltage exceeds uvlo release level (v ccuvr ), but igbt turns on by the next on signal (lin =l h). igbt of each phase can return to normal state by inputting on signal to each phase. b2 normal operation: igbt on and outputs current i c . b3 lvcc drops to uv lo trip level (v ccuv t ) . b4 all low side igbts turn off in spite of control input condition. b5 fo outputs for t fo =minimum 20 s , but output is extended while lvcc is below v ccuv r. b6 lvcc reaches v ccuv r . b7 even if lvcc reaches v ccuv r during lin=h, igbt s don s don
11 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 4 ) thermal shutdown (tsd), monitoring lvic temperature d 1 normal operation: igbt on and outputs current i c . d 2 lvic temperatur e ( t j ) ex ceeds thermal shutdown trip leve l ( t sdt ). d3 all low side igbts turn off in spite of control input condition. d 4 fo outputs for t fo = 20 s (min) , but output is extended while t j is above thermal shutdown release level ( t sdt - t sdhys ). d5 t j drops to t sdt - t sdhys d6 even if t j reaches t sdt - t s dhys during lin=h, igbt s don
12 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 application example( one shunt resistor drive) fig ure 1 4. example of application circuit vbu vbv vbw hinu hinv hinw h vcc gnd linu linv linw lvcc fo cin gnd p u v w nu nv nw m low side gate driver (lvic) high side gate driver (hvic) 24 23 22 21 20 19 18 mcu + 2 3 4 8 9 15 16 15v 14 10 11 12 13 5 6 7 5v + c1 d1 c2 c2 c2 d1 c3 + + r2 c5 r1 c4 shunt resistor bootstrap ne gative electrodes should be connected to u, v, w pin s directly and separated from the main output wires. long wiring here might cause short circuit failure. n d c long wiring here might cause scp level fluctuation and malfunction. a b +
13 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 selection of components externally connected (refer to fig ure 14) 1) vbu , vbv , vbw p in the bypass capacitor(good temperature, frequency characteristic electro lytic type c1: 22f to 100f ) should be mounted as close as possible to the pin in order to prevent malfunction or destruction due to switching noise and power supply ripple. in addition, for the purpose of reducing of the power supplys impedance in wide power supplys impedance in wide frequency bandwidth, ? ?
14 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 9 ) one - shunt r esistor d rive 1 0 ) three - shunt r esistor s d rive it is not recommended to input the voltage of each shunt resistor directly to the cin pin when ipm is operated with three shunt resistor. in that case, it is necessary to use the external protection circuit as below. it is necessary to set the time constant r u f f (1.0 s to 2.0 s is recommend ed) of external comparator input so that igbt stops within 2 s when short circuit occurs. please confirm operation on the actual application since scp shutdown time changes depending on the pcb wir ing pattern . it is recommended for the threshold voltage v ref to be set to the same rating of short circuit trip level( v sc = 0.48v(typ) ) to prevent malfunction , the wiring of a, b, c should be as short as possible. or output high level when protection works should be 0.53v(maximum v sc rating) to 7v(cin absolute m aximum rating). ipm gnd nu nv nw nu, nv, nw should be all connected each other at nearest pins. n wiring inductance should be less than 10nh. ( inductance of a copper pattern with length=17mm, width=3mm is about 10nh. ) low inductance shunt resistor like surface mounted (smd) type is recommended. rc filter wiring from gnd pin should be connected close to the pin of shunt resistor. wiring from shunt resistor to rc filter should be connected near the pin of shunt resistor. fig ure 15 . wiring pattern a round the shunt resistor when operating with one - shunt resistor fig ure 16 . wiring pattern around the shunt resistor when operating with three - shunt resistors ipm gnd nu nv nw n wiring inductance should be less than 10nh. ( inductance of a copper pattern with length=17mm, width=3mm is about 10nh. ) wiring from g nd pin should be connected close to the pin of shunt resistor. cin vref 5v wiring from shunt resistor to rc filter should be connected closet to the pin of shunt resistor. external protection circuit + - + - + - comparator ( open collector typ e ) b a c or output r f c f
15 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 i/o e quivalence c ircuit hinx linx 5k
16 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ipm . take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ipm s power supply
17 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 ordering i nformatio n b m 6 3 7 6 3 s - xx part number package s : hsdip25 :hsdip25vc packaging and forming s pecification - va : tube, long pin type - vc: tube, staggered type(control side) marking diagram part number marking lot number bottom view
18 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 physical dimension , tape and reel information package name hsdip25
19 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 physical dimension , tape and reel information C
20 / 20 b m63 7 63 s - va bm63763s - vc tsz02201 - 0747ab500050 - 1 - 2 ? 20 1 4 rohm co., ltd. all rights reserved. 11.nov.2014 rev.002 www.rohm.com tsz22111 15 001 revision history date revision changes 0 5 . aug .201 4 001 n ew release 11.nov.201 4 002 bm63763s - vc added
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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